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【UHS_X-ray CT System Imaging Case】FET Observation Case

This is a case where a FET was CT imaged using the Micro Focus X-ray CT system XVA-160RZ, and voids were detected.

This is an example of a FET (Field Effect Transistor) captured using 3D oblique CT. In fluoroscopy, it is difficult to distinguish the voids in each layer because the solder at the mounting part overlaps with the solder under the chip. Therefore, by performing CT imaging, it becomes possible to observe the sections separately, as shown in the attached materials. The XVA-160RZ allows for specifying the imaging area during the fluoroscopic observation phase through its user-centric function, enabling a transition to 3D oblique CT imaging without removing the sample, which also contributes to reducing labor costs.

  • Non-destructive testing

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